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Research on Tire Pressure Sensor Based on Surface Acoustic Wave

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Tutor: LiuSheng
School: Huazhong University of Science and Technology
Course: Subtle manufacturing engineering
Keywords: TPMS,SAW Resonator,Hermetical Packaging,Glass Frit
CLC: TH812
Type: Master's thesis
Year:  2007
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With the rapid development of modern automobile industry, the per-capita car ownership is growing with great speed. On the other hand, more and more expressways are also in great development, so modern vehicles have reason to improve their speed continuously. As a result, to ensure the safety of automobiles is becoming increasingly demanding. Tire is one of the major components of a vehicle, and plays a key role in steering considering stability, comfort and safety. In order to meet the requisition of the vehicle in high speed, improvement in the quality and performance of the tire is required, and it is also necessary to develop an equipment capable of real-time monitoring the condition of the tire.On the bases of overall research and study on the current domestic and international Tire Pressure Monitoring Systems, a new kind of TPMS is put forward based on the technology of Surface Acoustic Wave with the advantage of wireless, batteryless, small size and high resolution. Theoretical design of SAW sensors were introduced, material and structure design of the SAW resonator as well as the manufacturing and packaging method were also studied in depth. The major research is summarized below.First, on SAW sensor: fundamental working principle is thoroughly investigated, including the propagation characteristics of Rayleigh Waves. Structures and working theories of different devices based on SAW are investigated. In addition, fabrication processes and common materials used in SAW are analyzed;Second, on designing of SAW resonator in pressure sensor: the resonator of SAW based pressure sensor is designed in detail, including the length of resonating cavity, parameters of interdigital transducer and reflector, as well as the metal plating. Finite element method is used in optimizing the location of two resonators on quartz chips. Samples are made according to the design.Finally, on packaging of pressure sensor: two-layer True All Quartz packaging is proposed. Quartz caps used as the upper layer of the sensor are designed and manufactured. In addition, low temperature glass frit bonding method is applied in packaging the sensor to form a hermetical bonding, and helium bomb test are used to detect the leakage rate of the packaged sensor.
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