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The Research and Development of Fully Automatic Transistor Die Bonder

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Tutor: ZhangHongHai
School: Huazhong University of Science and Technology
Course: Subtle manufacturing engineering
Keywords: Die Bonder,Machine Vision,Image Matching,MMX technology
CLC: TN305
Type: Master's thesis
Year:  2007
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Abstract:
Automatic Transistor Die Bonder is a precision machinery , automatic control , image recognition , optics and other fields in one of the key semiconductor packaging equipment, mainly used in semiconductor manufacturing processes will be back on the microchip wafer bonded to the lead frame. This thesis focus on automatic transistor Die Bonder Expand R \u0026 D for Die Bonder some key technologies to achieve the theoretical algorithms and systems have been studied , mainly to complete the following several aspects: ( 1 ) overall design of the stick tablet machine main mechanical structure design, including film advance mechanism , welding head institutions , build vision systems and control systems, and industrial control computer through the control of the two subsystems . ( 2 ) Die Bonder image recognition system of image recognition system is the key transistor pasting machine parts , but also its difficulties, its accuracy directly affects the accuracy of the entire machine . In this paper , first of all existing digital image preprocessing techniques have been studied for the actual characteristics of the image focused on the histogram trimming and median filtering two kinds of image pre-processing techniques . Then, discuss the most commonly used types of image matching based on gray matching algorithms, including the relevant law , SSDA algorithm , MPSA algorithm, genetic algorithm, the comparative analysis of the specific test their advantages and disadvantages , and proposes a way to meet the system requires algorithm . Finally , with MMX technology to optimize the image preprocessing and image matching code to improve their operating speeds. ( 3 ) Die Bonder software system development according to business requirements to develop a fully automated software system Transistor Die Bonder , the successful realization of the automatic sticky film transistor . The entire software system with a simple, user-friendly, stable performance, fault alarm and so on.
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