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Research on Design and Packaging of Automobile Used Diffused Silicon Pressure Sensor

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Tutor: LiuSheng
School: Huazhong University of Science and Technology
Course: Subtle manufacturing engineering
Keywords: Automobile Electronics,Diffused Pressure Sensor,Isolated Packaging,Finite Elemen
CLC: TP212
Type: Master's thesis
Year:  2007
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The diffused pressure sensor has been developed for more than 30 years. During this time, its theories are becoming more and more ameliorative and more and broader applications have been found in different fields. Automotive electronics, as one of its most important applications, has almost been dominated by oversea products due to its characteristics of both low cost and high reliability. In consideration of great technical difficulties, high investments involved, and high risks of developing isolated packaged pressure sensors, there have been only several research organizations active in this field. The related research works initiated here in this research has been supported by an 863 program that is carried out at this historic moment and they contribute to the main contents of this dissertation.On the bases of overall research on the working principle and fabrication process of diffused pressure sensors, packaging configurations and processes are designed and optimized by the combination of finite elements analysis and experiments. Then temperature properties are analyzed and compensated. At last, samples are fabricated for testing of parameters and verification of theories. The major research is summarized below.First, on designing of pressure sensor: fundamental working principle is thoroughly investigated, with consideration of small deflection theory, large deflection theory and Wheatstone bridge theory; in addition, the fabrication processes of two regular types of pressure sensors are studied, and their sensitivities are calculated by finite elements analysis; Second, on packaging of pressure sensor: theories of process mechanics are applied to the modeling and simulation of packaging processes, such as die attachment, wire bonding and configuration design/optimization etc. Then, isolated packaging pressure sensors are well packaged, and their static parameters are experimentally obtained. At last, the reliabilities of pressure sensor are research in detail.Finally, on temperature compensation of pressure sensor: the reason why outputs vary as temperature changes is analyzed; the method of series or parallel connection resistors is conducted in compensation in order to minimize its temperature coefficient of zero output and sensitivity; finally, experiments provide the needed verifications for the above compensation method.
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